NHanced Semiconductors, the first US-based pure-play advanced packaging foundry, has launched a redesigned website with improved navigation and expanded news and blog features. A highlight of the new website design is insight into NHanced Semiconductors’ revolutionary Foundry 2.0 – a manufacturing model that applies semiconductor foundry processes and advanced packaging and assembly technologies to dies and chiplets sourced from traditional foundries.
Foundry 2.0 creates sophisticated 3DICs and 2.5D assemblies incorporating non-silicon materials, compound semiconductors, and passive devices. Foundry 2.0 enables customization and opens access to smaller market segments by performing cost-effective high-mix low- and medium-volume manufacturing
The new site features an expanded news and blog section; detailed listings of the company’s capabilities; profiles of the NHanced leadership team; and descriptions of its facilities in Batavia, IL, Morrisville, NC, and Odon, IN.
“The website displays the innovative semiconductor services that NHanced provides: leading-edge design, advanced packaging, and assembly,” explained NHanced President Bob Patti. “Our goal is to ensure that the US maintains and amplifies its leadership position in advanced semiconductor packaging.”
