Gstar has marked a significant milestone with the shipment of its first batch of core equipment for its new photovoltaic manufacturing facility in Indonesia.
SEALSQ and IC’ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
SEALSQ Corp. today announces a strategic collaboration with IC’ALPS, a ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels.
xMEMS Introduces Lassen, its First “Amplifier-less” High-Performance Silicon MEMS Tweeter Speaker
xMEMS Labs today announced xMEMS Lassen, the company’s newest innovation for delivering micro fidelity (µFidelity) audio to mass-market consumer earbuds.
Automotive Electrification Movement
Whether designing for passenger or commercial vehicles, engineers today must consider numerous complex, power-hungry systems and features that not only meet consumer and commercial demand but are also highly efficient, durable and safe.
Pragmatic Semiconductor Set to Revolutionize NFC Connectivity with Sustainable Flexible Chips
Pragmatic Semiconductor Ltd. today announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
Toray Engineering Co., Ltd. has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging.
The Shape of Tomorrow’s Semiconductor Technology
The theme of the 70th annual IEEE IEDM was “Shaping Tomorrow’s Semiconductor Technology.” Read about the latest advances in logic, memory, high frequency and power devices, and more.
Chaos, AI and the AMHS: An Update on Semiconductor Front-end Fab Logistics
Nonlinearity of AMHS models will present difficulties for oncoming AI applications.
Four Steps for Semiconductor Companies to Unlock the Value of Digital Twins
In semiconductors, digital twins can be used to introduce a new material into a technology node or utilized to replicate that material, and device performance from one fab to another.
Kulicke & Soffa Introduces Asterion-PW for Power Semiconductor Applications
Kulicke and Soffa Industries, Inc. announced the launch of Asterion-PW, extending its leadership in power device applications with a fast and precise ultrasonic pin welding solution.
