The SEMI Energy Collaborative today publicly released its analysis and report: Challenges and Potential Solutions for Acceleration of Low-Carbon Energy Deployment in Singapore.
SEALSQ Advances Quantum ASIC Development as Part of Its Quantum Roadmap
SEALSQ Corp. announced today a significant milestone in its Quantum Roadmap with the advancement of Quantum Application-Specific Integrated Circuit projects across multiple countries, including France, India, Spain, and USA.
Arteris Releases the Latest Generation of Magillem Registers to Automate Semiconductor Hardware/Software Integration
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced the immediate availability of the latest generation of Magillem Registers technology for SoC integration automation.
Micron Announces Shipment of 1γ (1-gamma) DRAM
Micron delivers superior performance and power efficiency to data center, client and mobile platforms with the industry’s first high performance 1γ node.
Emerson Partnership Bolsters UT Expertise in Semiconductors and AI
A new partnership between industrial technology leader Emerson and The University of Texas at Austin will support advanced research into artificial intelligence, automation, energy, semiconductors and more.
Allegro MicroSystems Appoints Mike Doogue as President and Chief Executive Officer
Allegro MicroSystems, Inc. today announced the appointment of Mike Doogue as President and Chief Executive Officer and as a member of the Board.
SEMICON Southeast Asia 2025 Celebrates 30 Years of Innovation Through Collaboration
SEMICON Southeast Asia will take place from 20-22 May at the Sands Expo and Convention Centre in Singapore.
Renesas Debuts Ultra-Low-Power RA4L1 MCUs with Capacitive Touch, Segment LCD and Robust Security
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power consumption, advanced security features and segment LCD support.
Imec Demonstrates Electrical Yield for 20nm Pitch Metal Lines Obtained with High NA EUV Single Patterning
This week at SPIE Advanced Lithography + Patterning, imec, a research and innovation hub in nanoelectronics and digital technologies, presents the first electrical test (e-test) results obtained on 20nm pitch metal line structures patterned after single-exposure High NA EUV lithography.
BrainChip Collaborates with Onsor Technologies
BrainChip Holdings Ltd today announced a collaboration with Onsor Technologies to enable an innovative approach using neuromorphic computing to predict epileptic seizures utilizing the Akida Platform in a wearable design.
