An Efficient Electrochemical Intercalation Method for High-Yield Production of TMD Nanosheets

Two-dimensional (2D) transition metal dichalcogenides (TMDs), an emerging class of materials that can be used as semiconductors and insulators, have promising potential in various applications due to their unique properties.

Applied Materials Earns Intel’s 2022 EPIC Outstanding Supplier Award with Supplier Diversity Distinction

Applied is one of only six Outstanding Award recipients in all of Intel’s global supply chain.

Quantum Brilliance Establishes Research Hub with La Trobe University and RMIT University to Accelerate Development of Diamond-based Quantum Computers

Research Hub for Diamond Quantum Materials will develop new fabrication methods for quantum microprocessors to increase computational power and enable mass-manufacturing of devices.

Top Five Leaders Continue Expanding Share of Global IC Fab Capacity

At the end of 2021, 57% of the industry’s total monthly wafer capacity was owned by the top five companies.

PragmatIC Semiconductor Unveils Plans for New UK Site

PragmatIC Park set to be a centre of excellence for flexible electronics design and manufacturing.

Global Semiconductor Sales Increase 32.4% Year-to-Year, 3.4% Month-to-Month in February

Sales into the Americas increase 43.2% year-to-year to lead all regional markets.

Marki Microwave Introduces High Frequency, Ultra-Small Form Factor Chip Scale Packaging Platform

Marki Microwave today introduced a family of GaAs monolithic microwave integrated circuit (MMIC)-based equalizers and attenuators, designed using the company’s new patent pending chip scale packaging (CSP) platform.

Kioxia Corporation Commences Construction of New Fabrication Facility at Kitakami Plant

Kioxia Corporation today held a groundbreaking ceremony for its semiconductor fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan.

Intel, Micron, and Analog Devices Join MITRE Engenuity’s Semiconductor Alliance

Intel, Micron, Analog Devices, and MITRE Engenuity announced they have an agreement of principles to accelerate semiconductor research, development, and prototyping to build a more robust U.S. semiconductor industry.

Imec and Buhler Leybold Enable High-Throughput Manufacturing of Filter-on-Chip CMOS Sensors

Today, imec and Buhler Leybold Optics announced they qualified Buhler’s HEKIOS 800 tool to meet the stringent standards of the semiconductor industry and developed high performance filters for optical image sensors.