Samsung Electronics Co. today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology.
Semiconductor Materials Supply-Chain Shortages
TECHCET CA LLC’s prediction of a wet chemical supply fallout is materializing.
CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard
New joint working group will enhance the OmniXtend Cache Coherency architecture.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the March issue…
Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
Intevac, Inc. today announced an INTEVAC MATRIX PVD order for fan-out applications in the advanced semiconductor packaging market.
Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
Cadence Design Systems, Inc. today announced that it has collaborated with GLOBALFOUNDRIES to successfully tape out a Cadence Tensilica test chip on GF’s 22FDX platform.
Intel Launches ‘IDM 2.0’ Strategy, Including Two New U.S. Fabs and Foundry Services
Intel’s new CEO Pat Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories fabs in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.
Texas A&M Researchers Optimize Materials Design Using Computational Technologies
Funded by the National Science Foundation (NSF), researchers at Texas A&M University are using advanced computational and machine-learning techniques to create a framework capable of optimizing the process of developing materials, cutting time and costs.
Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System
ClassOne Technology announced the sale of a second Solstice S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY.
Teledyne e2v HiRel Unveils Two New High-Power PIN Diode Limiter Modules
Limiter modules are designed for high reliability EW, radar applications. SCDs are supported, devices are tested and shipped from Teledyne’s certified US production facility
