The STMicroelectronics ISOSD61 and ISOSD61L are high-accuracy isolated, second-order sigma-delta modulators that deliver enhanced performance and reliability in industrial applications such as motor control, electric-vehicle charging stations, solar inverters, UPS, and server and telecom power supplies.
Busch Vacuum Solutions Launches Vacuum Pump Service Program
Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors, and systems, announced the launch of their new Exchange PLUS vacuum pump service program.
Flex Logix Raises $55M Series D Financing as It Accelerates Market Adoption of AI Inference and EFPGA Solutions
Flex Logix Technologies, Inc. announced today the close of a $55 million oversubscribed Series D funding round.
Global Semiconductor Materials Market Sets New High of $55.3 Billion With 5% Expansion in 2020, SEMI Reports
The global semiconductor materials market grew 4.9% in 2020 to $55.3 billion in revenue, surpassing the previous market high of $52.9 billion set in 2018, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).
Investment Needed in US$500M Sulfuric Market
IC fabs “life blood” may soon be in short supply in US.
NUST MISIS Scientists Take Step Towards Quantum Supremacy
A Russian-German research team has created a quantum sensor that grants access to measurement and manipulation of individual two-level defects in qubits.
SiFive and ArchiTek Enable Secure, Private, Flexible Edge AI Computing With AiOnIc Processor
SiFive, Inc., the provider of commercial RISC-V processor IP and custom silicon solutions, and Osaka R&D venture ArchiTek Corporation today announced ArchiTek’s first in-house developed AI processor, AiOnIc, featuring the ArchiTek Intelligence Pixel Engine (aIPE), and SiFive E3-Series RISC-V processor Core IP.
Size Matters When It Comes to Atomic Properties
A study from Chalmers University of Technology, Sweden, has yielded new answers to fundamental questions about the relationship between the size of an atom and its other properties, such as electronegativity and energy.
Nordson Electronics Solutions to Showcase Printed Circuit Board Assembly and Semiconductor Packaging Equipment at Productronica China and SEMICON China Tradeshows
Nordson Electronics Solutions are pleased to announce they will showcase many new dispensing, conformal coating, selective soldering, and surface treatment products and technologies at two events: Productronica China (Hall E6 booth #6202) and SEMICON China (Hall N4, booth #4022), both held at the Shanghai New International Expo Centre, Shanghai, China, March 17 – 20, 2021.
Deca Collaborates With ASE and Siemens to Launch APDK Design Methodology
Deca announced the introduction of its new APDK (Adaptive Patterning Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software.
