In a study published in Nano Letters, physicists from Michigan Technological University explore alternative materials to improve capacity and shrink the size of digital data storage technologies. Ranjit Pati, professor of physics at Michigan Tech, led the study and explains the physics behind his team’s new nanowire design.
CAD Design Software Introduces Four New Electronics Packaging Designer (EPD) Suites Powered by AutoCAD OEM
CAD Design Software (CDS), a leader in Electronic Design Automation (EDA) software solutions, today announces the creation of four new Electronics Packaging Designer (EPD) suites, EPD for Windows Suites, powered by AutoCAD OEM.
Boston Semi Equipment Receives Multiple Repeat MEMS Pressure Sensor and High Voltage Power IC Test Handler Orders from Automotive Chip Companies
Boston Semi Equipment announced today it received repeat orders from automotive customers for multiple Zeus gravity test handlers configured for MEMS pressure and high power IC testing applications.
Applied Materials Introduces New Playbook for Process Control Based on Big Data and AI
Applied Materials, Inc. today unveiled a major innovation in process control that uses Big Data and AI technology to help semiconductor manufacturers accelerate node development, speed time to revenue and earn more profits over the life of a node.
Lattice Partners with DARPA Toolbox Initiative to Accelerate Technology Innovation
Lattice Semiconductor Corporation today announced that the Lattice Diamond and Lattice Radiant FPGA design tools for its highly reliable, low-power, small form factor FPGAs are now included in the DARPA Toolbox initiative.
Keeping It Cool: New Approach to Thermal Protection in Outdoor Wearable Electronics
Scientists develop a radiative cooler that keeps wearable devices cool even under direct sunlight.
Dialog Semiconductor Adds Multi-Channel Input Capability to New Nanoamp GreenPAK Device
Dialog Semiconductor plc today announced the expansion of their popular GreenPAK solution suite with the SLG46811, the market’s smallest GreenPAK device to include an I2C communication interface.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
AP Memory and Ambiq Announce Partnership
AP Memory Technology Corporation together with Ambiq announce their partnership to enable richer experiences in next-generation battery-powered intelligent endpoint devices.
Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs
Fueled by surging pandemic-inspired demand for electronics devices, the global semiconductor industry is on track to register a rare three consecutive years of record highs in fab equipment spending with a 16% increase in 2020 followed by forecast gains of 15.5% this year and 12% in 2022.
