Samsung Electronics Co. announced that it has begun mass producing its most advanced line of data center SSDs, the PM9A3 E1.S.
DELO and Infotech Collaborate on 3D Printing System for Multi-material Designs
DELO has collaborated with Infotech, a Swiss-based company that recently introduced a unique and fully-automated system designed specifically for printing liquid materials and multi-material structures, to help with the production of components with different physical property ranges.
SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply Chain Incentives
SEMI today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.
Kioxia Commences Construction of New Fabrication Facility at Yokkaichi Plant
Kioxia Corporation held a groundbreaking ceremony for its semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan.
Micron Launches Low-Power Memory Qualified for Automotive Safety Applications
Micron Technology, Inc. today announced that it has begun sampling the industry’s first automotive low-power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL), ASIL D.
Photoresists Revenues to be up 11% to US$1.9B
TECHCET announces that the global market for photoresists needed in commercial semiconductor manufacturing is expected to be worth over US$1.9 billion in 2021.
North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
North America-based manufacturers of semiconductor equipment posted $3.04 billion in billings worldwide in January 2021 (three-month average basis), the first time monthly billings have reached $3 billion, according to the January Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
How Will a Post-Covid World Affect Users of Memory Technology?
Once the pandemic has passed, which changes in ordinary life are likely to endure? And how do memory IC manufacturers ensure that they are ready to meet the changed requirements of electronics device OEMs?
CEA-Leti & Dolphin Design Report FD-SOI Breakthrough
CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques.
Cast Aluminum Solutions Launches Industrial Heater with Temps to 1110°F / 600°C
Cast Aluminum Solutions (CAS) – a leading supplier of precision-engineered thermal components used in semiconductor wafer processing applications – announced the launch of its new CAST-X High Temperature Heater line.
