The SEMI 3D & Systems Summit, taking place June 25-27, 2025 in Dresden, will showcase the forefront of technological advancement in semiconductor packaging and integration. Themed Heterogenous Integration: Bolstering Europe’s Resilience, the summit will unravel the latest breakthroughs driving innovation in chiplet architectures, hybrid bonding, photonics, and advanced system-level design. From geopolitical dynamics to chiplet applications and hybrid bonding techniques, attendees will dive deep into the critical role of 3D and heterogeneous integration in strengthening Europe’s semiconductor value chain. Registration is open.
“SEMI Europe looks forward to welcoming global advanced packaging experts to Dresden,” said Laith Altimime, President of SEMI Europe. “With an exceptional speaker lineup and a sold-out exhibition, the Summit will spotlight critical advancements in chiplet technologies, hybrid bonding, and photonics – all essential for enabling next-generation intelligent systems and bolstering Europe’s technological resilience.”
This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:
- Geopolitical Dynamics and Market Trends in a Global Semiconductor Landscape
- Chiplet Applications and System-Level Architectures
- Hybrid Bonding Technologies for Die-to-Wafer and Wafer-to-Wafer Integration
- Photonics and Co-Packaged Optics
- Innovation and Sustainability in 3D Integration
- European Readiness in Design, Materials, and Manufacturing
- NextGen Talent: Empowering Careers, Driving Growth
Featured Speakers
- Christian Koitzsch, President & Managing Director, European Semiconductor Manufacturing Company (ESMC)
- Dave Thomas, Vice President, Product Management, SPTS Technologies, KLA
- Dirk Drescher, Plant Manager, Robert Bosch Semiconductor Manufacturing Dresden
- Georg Roell, Chief Technology Officer, RANOVUS Inc.
- Isabella Drolz, Vice President, Marketing & Product Strategy, Comet
- Jan Vardaman, President, TechSearch International
- Jekaterina Viktorova, Founder & CEO, Syenta
- Peter Jenkins, President & CEO, Infinitesima
- Seung Kang, Senior Vice President, Semiconductor Strategy, Adeia
- Sébastien Dauvé, CEO, CEA-Leti
- Stephan Guttowski, Managing Director, Fraunhofer Group for Microelectronics
- Thomas Kralinski, Saxon State Secretary of Economic Affairs, Labour, Energy and Climate
Networking
This year’s networking reception will take place at the Hilton Dresden Hotel on the first day of the event, and the Networking Dinner Cruise is set on a historic paddle steamer on the Elbe River, just a 5-minute walk from the Hilton Dresden Hotel.
Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2025 participants.
Exhibition
The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies in the new exhibition area. Exhibitors include: AEMtec GmbH, Adeia Inc., ASE Global, ASMPT, Besi, Carl Zeiss (ZEISS Microscopy), Comet, Confovis, cyberTECHNOLOGIES, DISCO HI-TEC Europe, FAMES, Fraunhofer IZM-ASSID, Fraunhofer – Verbund Mikroelektronik (FMD), Heidenhain, Kistler AG, Kontron AIS, NanoFocus AG, PLANOPTIK, Precitec Optronik GmbH, SET (Smart Equipment Technology), Syenta, Wooptix.
