SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics

Themed Heterogenous Integration: Bolstering Europe’s Resilience, this year’s Summit will feature an expanded program covering geopolitical dynamics, market trends, chiplet design, as well as the latest advancements in chiplet applications and hybrid bonding techniques.“We look forward to welcoming industry leaders, innovators, and researchers to showcase their latest technologies and developments at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “As Europe advances in chiplet architectures, hybrid bonding, and co-packaged optics, the Summit provides a unique platform to drive collaboration and highlight the innovations shaping the future of semiconductors.”

3D & Systems Summit Sessions

NextGen Talent: Empowering Careers, Driving Growth

Featuring insights from semiconductor leaders, educators, and students, this session will highlight best practices for attracting, developing, and retraining top talent. Experts will discuss strategies that foster innovation, bridge talent gap, and create meaningful career opportunities—key to securing Europe’s continued leadership in the semiconductor industry.

Session 1: Geopolitical Dynamics and Market Trends

Executive leaders will examine how geopolitical dynamics are reshaping the semiconductor industry, highlighting Europe’s strategic role amid global demand shifts and supply chain disruptions.

Session 2: Chiplet Applications: System Level Architectures

Industry experts will explore the diverse applications of chiplet technology in various fields, highlighting the conceptual aspects of design and 3D integration.

Session 3: Hybrid Bonding – Die to Wafer

Specialists will focus on die-to-wafer hybrid bonding and its role in enabling advanced 3D integration, with insights into scalability, cost-effectiveness, and the roadmap for industry adoption.

Session 4: Hybrid Bonding – Wafer to Wafer

Experts will discuss wafer-to-wafer hybrid bonding technologies and examine the current state of these technologies as well as the technical and market challenges they face.

Session 5: Photonics and Co-Package Optics

Industry leaders will share insights into the integration of photonics and co-package optics, and how these advancements can drive innovation and efficiency across diverse industries.

Session 6: European Readiness: Design, Materials, Manufacturing

Visionaries will explore the design, materials, and manufacturing scalability of technologies, highlighting key challenges, cost-effective factors, and innovative solutions for advancing 3D integrated circuits and chiplet production.

Global Leaders to Present

3D & Systems Summit presenters include experts from these global leaders:

• Adeia
• ASML
• Besi
• Bosch
• CEA-Leti
• Confovis
• ETEL S.A.
• European Semiconductor Manufacturing Company (ESMC)
• EV Group
• Fraunhofer
• imec
• Infinitesima
• Intel
• KLA
• Lam Research
• NXP Semiconductors
• RANOVUS
• SUSS MicroTec
• TechSearch International
• Yole Group

Exhibition and Business Networking

The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact euevents@semi.org.

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise.

Networking dinner registration is reserved exclusively for 3D & Systems Summit 2025 participants. Guests may register their spouse for dinner through the registration link.