Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University learning platform to include in-person trainings. Complementing SEMI U online courses, the semiconductor curriculum is designed for technicians, engineers and non-technical staff ranging from new hires to experienced workers looking to advance their careers. The courses cover subjects including front-end and back-end manufacturing operations, principles of chip design, and rapidly evolving technologies such as artificial intelligence (AI), MEMS and advanced packaging.
The initial in-person trainings will be held at SEMI headquarters in Milpitas, California. See the SEMI University Course Calendar for upcoming sessions. SEMI U will also offer instructor-led trainings on July 8, 2024, at the Moscone Center in San Francisco preceding SEMICON West 2024, July 9-11. Discounted SEMI U: Pre-Show Training sessions are available for SEMICON West attendees and students.
“SEMI member companies have flagged the semiconductor industry talent and skills gap as a top concern that could impact long-term growth,” said SEMI University Director Naresh Naik. “Our new SEMI U in-person trainings bolster our online courses in supporting industry efforts to train and upskill employees and help incoming talent establish their careers in pursuing growth. We carefully curated each course topic based on industry demand, emerging trends, and feedback from our existing online courses. By focusing on these specific areas, we aim to address the most pressing needs of our audience, providing them with practical skills and knowledge that are directly applicable to their roles and career advancement.”
SEMI U in-person course topics include:
- Silicon Substrates Preparation, Identifying, and Preventing Defects
- Plasma Etching, ALE and RIE
- ABCs of Basic Electronics
- Introduction to Semiconductor Design and Fabrication for Non-Techies
- Overview of Semiconductor Manufacturing
- Introduction to IC Packaging and Assembly
- Flip Chip Packaging
- Patents and Intellectual Property for Technology Companies
- MEMS Product Development for Current and Emerging Markets
- Understanding Semiconductor Technology and Business
