The Fusion® F07 is crafted to withstand common etch and CVD oxygen/fluorine based gases in semiconductor processing subfab lines, at temperatures up to 355°F (180°C).
Semiconductor Materials Market: Better Things to Come in 2024
The total semiconductor materials market is forecasted to rebound with almost 7% growth in 2024 to reach US$74 billion. This upwards turnaround comes after a contraction of -3.3% in 2023 due
Atomic Layer Deposition Gains Traction in More-than-Moore Device Production
ALD adoption is likely to continue despite aggravating supply chain issues and production costs.
Surface Preparation for Low Temperature CVD Si Epitaxy Processing
Methods for producing the pristine and stable hydrogen-terminated single crystal silicon surfaces required to achieve the specifications for LT CVD epi silicon layers are investigated.
Electronic Materials Specifications and Markets
At SEMICON West this year, July 14-16 in San Francisco, the Chemical and Gas Manufacturers Group (CGMG) Committee of SEMI have organized an excellent program covering “Contamination Control in the Sub-20nm Era” to occur in the afternoon of the 14th…
Bottoms-up ELD of Cobalt Plugs
As reported in more detail at Solid State Technology, during the IEEE IITC now happening in Grenoble, imec and Lam showed a new Electroless Deposition (ELD) cobalt (Co) process that is claimed to provide void-free bottoms-up pre-filling of vias and…
