Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions

Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.

Patterning with Films and Chemicals

Somewhere around 40nm is the limit on the smallest half-pitch feature that can be formed with a single-exposure of 193-nm wavelength laser light using water immersion (193i) lithography. While multiple-patterning (MP) is needed to achieve tighter half-pitches, smaller features at…

Dow Kills CIGS Solar Shingles

The mega-merger between Dow and DuPont has already shaken out an under-performing product line:  Powerhouse(TM) solar singles. As reported at PVTech, over 100 jobs in Milpitas, California and in Midland, Michigan will be lost along with the production line that…

Trefonas Earns 2016 Perkin Medal

The Society of Chemical Industry (SCI), America Group, announced on May 5, 2016 that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at Dow Chemical Co (NYSE:DOW), has won the 2016 SCI Perkin Medal. This honor recognizes Trefonas’ contributions in…