Veeco Instruments Inc. (NASDAQ: VECO) announced today that it received multiple orders for Laser Spike Annealing (LSA) systems from a world leading memory device manufacturer. Notably, these are Veeco’s first systems for high volume manufacturing for DRAM devices. The company also announced it received multiple orders from its most recent advanced logic customer to support their production ramp. Veeco continues to execute its strategy of gaining market share through new applications wins.
“We are proud to have our LSA platform selected for high volume manufacturing by leading memory and logic device manufacturers,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “Veeco’s LSA system is widely acknowledged as the optimum annealing solution for low thermal-budget applications. As devices evolve at advanced nodes, precise annealing by our LSA platform is becoming more critical. The successful penetration in DRAM is expected to significantly increase our served available market.”
Laser spike annealing is a millisecond annealing technology used in front-end semiconductor manufacturing to lower resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high temperature annealing while staying within reduced thermal budgets of advanced devices at leading edge nodes. These annealing steps are instrumental in determining the electrical properties and performance of the resulting devices.
Shipping from Veeco’s new facility in San Jose, CA, these new orders represent the growing demand for Veeco’s advanced process technologies in the semiconductor industry.
