IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2020, which will be released in January 2020. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organization (WSTS) through the year 2024. The top five categories for IC product growth are covered in this bulletin.
OneSpin Addresses the Challenges of RISC-V Verification at the Annual RISC-V Summit
OneSpin Solutions, provider of certified IC integrity verification solutions for building functionally correct, safe, secure, and trusted integrated circuits, will showcase its verification expertise of RISC-V processor cores at the upcoming RISC-V Summit being held December 10-12, 2019 at the San Jose Convention Center. OneSpin will host attendees at both its booth and a demo pod in the OpenHW pavilion at the RISC-V Summit, while the company’s experts will present two sessions on verifying RISC-V SoCs.
IEDM’s Monday is MRAM Day – Part 2
Samsung gives a second paper this session, detailing (2.5) A Novel Integration of STT-MRAM for On-chip Hybrid Memory by Utilizing Non-Volatility Modulation, with Jeong-Heon Park as lead author. “We demonstrate a novel way of integrating STT-MRAM for on-chip hybrid memory which exhibits either features of high-retention or high-speed implemented in separate zones in a single chip. For satisfying high temperature retention requirement, tailored MTJs are shown to support >10-year retention at 220℃.” MRAM switching protocols can be tuned for either high speed or high retention, so here we have a process which gives the option of both on the same die.
Diamonds In Your Devices: Powering the Next Generation of Energy Storage
Our use of battery-operated devices and appliances has been increasing steadily, bringing with it the need for safe, efficient, and high-performing power sources. To this end, a type of electrical energy storage device called the supercapacitor has recently begun to be considered as a feasible, and sometimes even better, alternative to conventional widely used energy-storage devices such as Li-ion batteries. Supercapacitors can charge and discharge much more rapidly than conventional batteries and also continue to do so for much longer. This makes them suitable for a range of applications such as regenerative braking in vehicles, wearable electronic devices, and so on.
Boréas Technologies’ New Chip-Scale Haptic IC Drives HD Touch in Smallest Electronics
Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its flagship low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless smartphones, smartwatches, game controllers and other battery-powered devices. Featuring WLCSP packaging, the BOS1901CW is just 2.1×2.2×0.6 mm and consumes just one-tenth the power of its nearest piezoelectric (piezo) competitor, making it small and low-power enough for the most resource-constrained devices.
