EV Group partners with NSI on first wafer-level heterogeneous integration of GaAs on silicon

EV Group (EVG), a supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology…

Intel surpasses Samsung in semiconductor sales revenue in Q4 2018

Samsung maintains number one ranking in semiconductor sales for the total year 2018. The declining market for semiconductors used in mobile handsets and enterprise servers led to a realignment in the company market-share ranking for semiconductor manufacturers. While Samsung led…

MACOM and GLOBALFOUNDRIES collaborate to scale silicon photonics to hyperscale cloud Data Center and 5G network buildouts

Production scale of 300mm wafers is expected to enable exponential port growth in cloud Data Centers and 5G networks. MACOM Technology Solutions Inc. and GLOBALFOUNDRIES announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using…

AI needs memory

A new report by Forrester Consulting, commissioned by Micron, takes a look at how companies are implementing AI and the hardware they are using, with a special focus on memory and storage.

Intel announces tweaks to 22FFL process for RF, MRAM at IEDM18

Part 2 – MRAM in 22FFL The second 22FFL paper at IEDM18 [1] describes the integration of Magnetic Tunnel Junction (MTJ)-based MRAM (magnetic random-access memory) into the back-end of the process. MTJ technology is attractive for embedded non-volatile memory because…

Intel announces tweaks to 22FFL process for RF, MRAM at IEDM18

At IEDM last year, Intel gave a half-dozen papers on various topics, including two on their 22FFL SoC process aimed at low power IoT and mobile products. The first (14.1) was an invited presentation on “Intel 22nm FinFET (22FFL) Process…

Skin-Like Biocompatible Devices Come to Market – and to FLEX/MSTC

By Maria Vetrano As director of the Center for Bio-Integrated Electronics at Northwestern University, Professor John A. Rogers explores soft materials for conformal electronics, nanophotonic structures, microfluidic devices and MEMS, all with an emphasis on bio-inspired and bio-integrated technologies. During…