A team of University of Arkansas physicists has successfully developed a circuit capable of capturing graphene’s thermal motion and converting it into an electrical current.
Semtech Appoints New Directors to Its Board
Semtech Corporation today announced that the Company has increased the size of its board of directors to 11 members and has appointed Paula LuPriore and Martin S.J. Burvill to fill the vacancies as a result of the increase in the number of directors.
Intel and Sandia National Labs Collaborate on Neuromorphic Computing
Today, Intel Federal LLC announced a three-year agreement with Sandia National Laboratories (Sandia) to explore the value of neuromorphic computing for scaled-up computational problems.
Intel Wins US Government Advanced Packaging Project
The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program.
Metrology Solutions for Gate-All-Around Transistors in High Volume Manufacturing
High-speed, non-destructive OCD metrology has the capability needed to support process control throughout the GAA process flow.
The Most Sensitive and Fastest Graphene Microwave Bolometer
Scientists from Harvard, ICFO, MIT, Raytheon BBN Technologies and NIMS construct the fastest and most sensitive graphene-based microwave bolometer achieved so far.
Colloidal Quantum Dot Light Emitters Go Broadband in the Infrared
Broadband light emission in the infrared has proven to be of paramount importance for a large range of applications that include food quality and product/process monitoring, recycling, environmental sensing and monitoring, multispectral imaging in automotive as well as safety and security.
IAR Systems Supports Ultra-Low-Power Renesas RE MCU Family in Industry-Leading Arm Tools
IAR Systems, the future-proof supplier of software tools and services for embedded development, announces the update of its leading development toolchain IAR Embedded Workbench for Arm. The update includes complete coverage for the ultra-low-power Renesas RE microcontroller (MCU) Family.
Busch Innovation in Vacuum Award Goes to Dilo
Dilo Armaturen und Anlagen GmbH has received the “Busch Innovation in Vacuum Award” from Busch Vacuum Solutions. The prize commends Dilo’s pioneering work in handling gases.
Pioneering Liquid Compression Molding Material from Henkel Advances Fan-In and Fan-Out Wafer-Level Packaging
Henkel Corporation today announced the commercial availability of LOCTITE ECCOBOND LCM 1000AF, a breakthrough encapsulation material that leverages a unique anhydride-free resin platform to enable thorough protection, improved warpage control and fine gap filling for fan-in and fan-out wafer-level packages (FI WLPs, FO WLPs).
