First R&D Facility in North America enables entry to power management IC market.
Analog Market Momentum to Continue Throughout 2022
Market forecast of 12% growth in 2022 follows historic 30% jump in analog sales in 2021.
Pusan National University Scientists Review Latest Progress in Wearable Energy Harvesting and Storage
Pusan National University scientists take stock of the latest developments in energy harvesting and storage technology for wearable devices, with a focus on nanomaterials and their assembly into various macroscale structures.
Semtech’s LoRa Devices and the LoRaWAN Standard Serve as “IoT Backbone” of New Vutility Energy Monitoring System
Semtech Corporation announced its collaboration with Vutility, provider of real-time, high-resolution, energy monitoring solutions – enabling businesses to optimize their energy consumption and improve operational efficiencies.
OQmented Opens US Office in Silicon Valley
The technology leader in MEMS-based AR/VR-display and 3D sensing solutions reacts to growing demand and establishes regional presence in North America for close proximity to customers and partners.
CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.
Lam Research President and CEO Tim Archer Testifies Before the United States Senate Commerce Committee
Lam Research Corp. President and CEO Tim Archer testified today before the United States Senate Committee on Commerce, Science, and Transportation for a hearing entitled, “Developing Next Generation Technology for Innovation.”
STMicroelectronics’ 50W GaN Converter Enables High-Efficiency Power Designs in Consumer and Industrial Applications
The STMicroelectronics VIPerGaN50 simplifies building single-switch flyback converters up to 50 Watts and integrates a 650V gallium-nitride (GaN) power transistor for superior energy efficiency and miniaturization.
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Kitakami Plant
Kioxia Corporation today announced it will begin construction of a new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH.
A Stretchy Display for Shapeable Electronics
No one would ever imagine crumpling up their smartphone, television or another electronic device. Today’s displays – which are flat, rigid and fragile – lack the ability to reshape to interactively respond to users.
