Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.
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The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World
Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.
Erik Pederson Joins Semiconductor Industry Association as Government Affairs Director
The Semiconductor Industry Association (SIA) announced Erik Pederson has joined the association as government affairs director. In this role, Pederson will work with Congress, the White House, and federal agencies to advance the semiconductor industry’s policy priorities, particularly those related to trade, export control, and tax. SIA represents U.S. leadership in semiconductor manufacturing, design, and research.Pederson most recently served as director of government relations at the Chicago Council on Global Affairs, a bipartisan think tank.
North American Semiconductor Equipment Industry Posts August 2019 Billings
North America-based manufacturers of semiconductor equipment posted $2.00 billion in billings worldwide in August 2019 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final July 2019 level of $2.03 billion, and is 10.5 percent lower than the August 2018 billings level of $2.23 billion.
Edwards’ 100th Year Environmental Award Recognises SEMI High-Tech Facility Committee
Edwards presented its 100th Year Environmental Award to SEMI’s High-Tech Facility Committee at a ceremony held last night in conjunction with the SEMICON Taiwan conference. The award recognizes an individual or group within the semiconductor industry that has made a significant contribution to the protection of the environment for future generations. Edwards created the award to celebrate its own one-hundred-year history creating environments where innovation can thrive.
Bayesian Machine Learning Enables a Virtual Defect Pareto Through Software Simulation
A Failure Mechanism Pareto can be derived through software by applying Bayesian Machine Learning to diagnostic fault simulations.
DRAM, NAND and Emerging Memory Technology Trends and Developments in 2019
Innovation in memory technology is constant. In this article, TechInsights’ Jeongdong Choe reviews the latest developments in DRAM, NAND, and emerging technology, and provide insight on the trends in this space.
IBM and Fraunhofer Join Forces on Quantum Computing Initiative
IBM and Fraunhofer-Gesellschaft announced an agreement to partner in the area of quantum computing with the goal of advancing the research and experimentation in Germany.
Texas Instruments Unveils Solderless Robotics Kit for University Education
Texas Instruments (TI) (Nasdaq: TXN) today introduced the newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX, a low-cost robotics kit and curriculum that is simple to build, code and test. Designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in under 15 minutes. Classrooms that may not have access to soldering equipment benefit from the solderless, hands-on kit and curriculum that can be reused year after year.
