Energous Corporation, a developer of RF-based charging for wireless power networks, and ams OSRAM, a global leader in optical solutions, today announced a collaboration on a wirelessly powered multi-spectral light sensor for Controlled-Environment Agriculture (CEA) and vertical farming.
Design
Moore’s Law Inevitable Decline Opens New Path to IC Innovation
“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli.
Researchers Develop All-Optical Approach to Pumping Chip-Based Nanolasers
New technology could aid in meeting the ever-growing need to move more data faster.
NCKU Researchers “Weave Single Crystal Thin Films” to Fabricate Twisted Epitaxial Lateral Homostructures
A team of researchers led by Prof. Jan-Chi Yang from National Cheng Kung University described how inserting a freestanding oxide layer assisted the generic approach for synthesizing epitaxial twisted oxide lateral homostructures.
Arizona State University to Advance Proposal for CHIPS and Science Act Funding
ASU will offer regionally collaborative proposal to advance microelectronics research, development and manufacturing in Arizona and southwest region as part of national network.
Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips
Applied Materials, Inc. today announced the commercial availability of “cold field emission” (CFE) technology, a breakthough in eBeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation Gate-All-Around (GAA) logic chips as well as higher-density DRAM and 3D NAND memories.
Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards
Cadence Design Systems, Inc. today announced that it has won six Open Innovation Platform (OIP) Partner of the Year awards from TSMC for its EDA, IP and cloud solutions.
Bolstering the Safety of Self-Driving Cars with a Deep Learning-based Object Detection System
An Internet-of-Things-enabled, real-time object detection system developed by researchers could make autonomous vehicles more reliable and safer.
Toshiba Develops SiC MOSFET with Embedded Schottky Barrier Diode that Delivers Low On-Resistance and High Reliability
Toshiba Electronic Devices & Storage Corporation and Toshiba Corporation have developed an SiC metal oxide semiconductor field effect transistor (MOSFET) that arranges embedded Schottky barrier diodes (SBD) in a check pattern (check-pattern embedded SBD) to realize both low on-resistance and high reliability
Congratulations to the 2022 Recipients of GSA’s Prestigious Annual Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala.
