Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete, since they are too expensive and time-consuming for the most advanced processes.
Editor’s Picks
The Chip Warriors: A Podcast Documentary Series
America won the first cold war by outspending the Soviet Union in nuclear weapons. Many observers believe the US is engaged in a new cold war – with China. If true, it will be fought with technologies like 5G, artificial intelligence and semiconductors – but this time the US is being outspent.
Powering Ahead
Integrated RF and tuning networks, solid-state tuning networks, non-sinusoidal bias for tailored ion energy distribution, and predictive power delivery will enable process applications at advanced technology nodes.
Advanced Packaging Market to Witness Steady Growth of 8% During 2020-2026
According to a recent study from market research firm Global Market Insights, the advanced packaging market is set to grow from its current market value of more than $25 billion to over $40 billion by 2026, gaining remarkable traction over the 2020 to 2026 period.
Five Trends That Will Shape the Future Semiconductor Technology Landscape
Is Moore’s Law still alive, and which applications will benefit from ultra-scaled technologies? How will data centers cope with the overwhelming amount of data? And will we be able to break the memory wall in traditional Von Neumann computing architectures?
How COVID-19 is Impacting the Memory Industry
Heading into 2020 both the DRAM and NAND industries were projected to have turn-around years after suffering through much of 2018 and 2019. However, with the global lockdown triggered by the COVID-19 pandemic the outlook for the industry has changed considerably, and not all the change is for the worse. In this article we explore the impact on memory demand, how suppliers are expected to react to the pandemic, and the likely impact to pricing over the near-to-midterm.
Intel Wins US Government Advanced Packaging Project
The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program.
Metrology Solutions for Gate-All-Around Transistors in High Volume Manufacturing
High-speed, non-destructive OCD metrology has the capability needed to support process control throughout the GAA process flow.
The CNT Success Story Begins, IDTechEx Forecasts Significant Growth
Carbon nanotubes (CNTs) have been known for many decades, but the moment of significant commercial growth is just approaching.
Not All COVID-19 Tests Are Created Equal – New Biosensors to Improve Speed and Connectivity
While the world awaits a working vaccine to protect us from COVID-19, we need to employ all available tools to help curb the spread of this novel virus.
