Advanced Energy today announced the launch of this year’s Advanced Energy STEM Diversity Scholarship Program.
MEMS
2022 Semiconductor Materials Outlook: COVID-19 Pandemic Still Having Lasting Effects on All Materials
The COVID-19 pandemic has created strong demand for both logic and memory ICs to support continued Work from Home and School from Home, and as such demand is expected to increase despite expanding availability of virus vaccines.
Valens Semiconductor First-in-Industry to Ship Engineering Samples of MIPI A-PHY Standard Chipsets to Leading Automotive OEMs and Tier 1s
The Valens VA7000 chipset family is the first on the market to implement the MIPI A-PHY standard for in-vehicle sensor connectivity.
New IDC Spending Guide Forecasts Double-Digit Growth for Investments in Edge Computing
Worldwide spending on edge computing is expected to be $176 billion in 2022, an increase of 14.8% over 2021.
DuPont To Launch Pyralux HP Laminate Adhesive System for High-Performance Electronics
DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.
Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips
Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.
Gelest Inc. Names Dr. Jonathan Goff as President
Gelest Inc. names Dr. Jonathan Goff as President of Gelest effective immediately.
Advancing the Future of Semiconductor Manufacturing
Manufacturing innovation can be achieved through greater capacity utilization, component reliability, and process control.
VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving
VSORA, provider of high-performance silicon intellectual property (IP) solutions for artificial intelligence (AI), digital communications and advanced driver-assistance systems (ADAS) applications, today unveiled a family of PetaFLOPS computational companion chips to accelerate Level 3 (L3) through Level 5 (L5) autonomous vehicle designs.
Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD
Micron Technology, Inc. today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications.
