Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
Packaging
Siemens and Intel Foundry Advance Collaboration
Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement.
Northeast Microelectronics Coalition Hub Launches $10 Million SCALE Capital Program to Advance Microelectronics Industry
The Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech) launched the SCALE Capital program, a $10 million grant initiative to advance microelectronics capability, training and product development across Massachusetts.
Veeco’s WaferStorm and WaferEtch Wet Processing Platforms Qualified for Advanced Packaging Applications
Veeco Instruments Inc. today announced a global Semiconductor IDM qualified Veeco’s WaferStorm and WaferEtch platform for two new applications in Advanced Packaging.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
ROHM Develops New High Power Density SiC Power Modules
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).
M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC’s 3nm process and has successfully completed tape-out on TSMC’s 2nm process.
Advanced Chip Packaging/Microsystems Breakthroughs to be Presented at Upcoming IEEE ECTC Conference
The IEEE Electronic Components and Technology Conference (ECTC) is the world’s premier conference and product exhibition for bringing together the best in chip packaging, components, and microelectronic systems in an environment of cooperation and technical exchange.
TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
Showcasing TSMC’s latest offerings for high performance computing, smartphone, automotive, and IoT applications.
