The SEMI 3D & Systems Summit, taking place June 25-27, 2025 in Dresden, will showcase the forefront of technological advancement in semiconductor packaging and integration.
Packaging
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
TECHCET Projects Positive Outlook for Metal Chemicals
TECHCET forecasts a nearly 10% increase in revenue for semiconductor plating chemicals in 2025, reaching an estimated $1.19 billion.
GENESIS Project Launches to Lead Europe’s Transition To Sustainable Semiconductor Manufacturing
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry today announced the launch of the GENESIS project.
Alphawave Semi Tapes Out Breakthrough 36G UCIe IP on TSMC 2nm
Alphawave Semi announced the successful tape out of one of the industry’s first UCIe IP subsystem on TSMC’s N2 process, supporting 36G die-to-die data rates.
Sarcina Technology Advances Photonic Package Design to Address Key Data Center Challenges
Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves.
GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
Backed by leading tech giants, the investment reinforces domestic semiconductor production and U.S.-based innovation in AI-enabling and power efficient technologies.
Optimizing Tester Memory Resources with Xtreme Pooling Technology
Xtreme Pooling extends vector-memory capacity up to 896 GV per pin by dynamically redistributing unused memory across test processors.
From Invention to AI Acceleration: Celebrating 40 Years of FPGA Innovation
This year marks the 40th anniversary of the first commercially available field-programmable gate array (FPGA), introducing the idea of reprogrammable hardware.
Marvell Delivers Advanced Packaging Platform for Custom AI Accelerators
Marvell Technology, Inc. has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that lowers total cost of ownership (TCO) for custom AI accelerator silicon.
