Researchers at EPFL and Harvard University have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device.
Packaging
Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan
Nordson Test & Inspection today announced plans to unveil advanced technology at SEMICON Taiwan, scheduled to take place at TaiNex in Taipei at booth #12326.
Sandisk to Collaborate with SK hynix
Sandisk Corporation today announced it has signed a landmark Memorandum of Understanding (MOU) with SK hynix to work together to establish the specification for High Bandwidth Flash.
AGY Launches New L-HDI Glass Fiber, Completing AI-Centric Product Portfolio
AGY, the US manufacturer of specialty glass fiber products, announced the launch of L-HDI, a new Low Coefficient of Thermal Expansion (CTE) glass fiber engineered specifically for advanced packaging substrates and chip packaging in next-generation AI hardware.
What’s in the July/August Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July/August issue.
NEO Semiconductor Introduces World’s First Extreme High Bandwidth Memory Architecture for AI Chips
NEO Semiconductor today introduced the world’s first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips.
TechSearch International Analyzes Large Body Size Package Challenges
Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication.
Everspin Appoints Sean Dougherty Vice President of Sales
Everspin Technologies, Inc., the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM), announced today the appointment of Sean Dougherty as Vice President of Sales, effective immediately.
Teradyne Unveils Magnum 7H: The Next-Generation Memory Tester for High Bandwidth Memory Devices
Teradyne, Inc. announced the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices, integrated with GPUs and accelerators in high-performance, generative AI servers.
Micron Unveils Portfolio of Industry-First SSDs to Power the AI Revolution
Today Micron extends its industry leadership in storage with the launch of three new data center SSDs all built with Micron G9 NAND.
