Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).
Packaging
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
The collaboration will provide GF with access to A*STAR’s R&D facilities, capabilities and technical support for technology development and workforce skills enhancement in advanced packaging.
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec.
ClassOne Technology and IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.
Toshiba and Global Power Technology Accelerate Their Patent Filings on SiC Power Devices
According to data from our SiC Patent Monitor, power silicon carbide (SiC) technology saw robust patenting activity in Q1 2025, with over 840 new patent families filed globally.
EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support
Establishment of fully owned subsidiary is the culmination of a decades-long commitment to the region supporting evolving needs in semiconductor wafer fabrication and packaging.
2025 Device Research Conference Brings Together Leading Researchers to Share the Latest Discoveries in Device Technology
The 2025 Device Research Conference (DRC) marks its 83rd anniversary as the longest running device research meeting in the world.
Pfeiffer Vacuum+Fab Solutions Introduces the CenterLine CNR Series
The CenterLine CNR series consists of analog capacitive vacuum gauges that can measure over four decades in the full scale between 0.1 and 1000 Torr.
AI Integration, Photonics, Edge Computing and Sustainable Electronics to Take Center Stage at 27th LID World Summit
LID World Summit 2025, June 17–19, will spotlight the foundational role of advanced semiconductors in unlocking the full potential of AI—from edge devices to data centers, and present innovative advances and ideas for key microelectronic sectors.
SEMI North America Advisory Board Welcomes New Member From SACHEM, Inc.
SEMI today announced the election of a new member to the SEMI North America Advisory Board (NAAB), Rosemary Steen Hoffman, Chief Executive Officer, SACHEM, Inc., a supplier of high-purity, precision-based chemistries.
