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Industry Reacts to Passage of CHIPS and Science Act of 2022

Semiconductor companies around the globe issued statements on Thursday following the passage of legislation of the CHIPS and Science Act of 2022 in the U.S. House of Representatives aimed at increasing American semiconductor manufacturing.

Flexible Hybrid Capacitors Based on Transition Metal Composite Electrode

The shortage of fossil energy sources lead to high requirements for the exploration of sustainable energy conversion and storage equipment. Supercapacitor (SC) is a kind of excellent energy storage device due to the high power density and long cycle life. However, the low energy density restricts their further practical application. Therefore, it is extremely important to develop high-performance electrode materials with excellent performances.

NEO Semiconductor Launches Second-Generation X-NAND Flash Memory Architecture

NEO Semiconductor, a developer of innovative architectures for NAND flash and DRAM memory, today announced the release of its second-generation X-NAND architecture.

Finwave Semiconductor Raises $12.2M Series A Funding Round to Advance the Ultimate Transistor for 5G

3DGaN (Gallium Nitride) innovators Finwave Semiconductor, Inc.ctor, Inc. today announced a $12.2 million Series A funding round led by Fine Structure Ventures with additional participation from Citta Capital, Soitec, Safar Partners and Alumni Ventures.

Improving Image Sensors for Machine Vision

On-chip spectrometer, silicon nanowires determine light spectrum, angle.

SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability

With Taiwan forecast to rank as a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2022 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth.

Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership

Micron Technology, Inc. today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions.

Intel and MediaTek Form Foundry Partnership

MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.

Using AI to Train Teams of Robots to Work Together

University of Illinois Urbana-Champaign researchers developed a method to train multiple agents such as robots or drones to work together using multi-agent reinforcement learning, a type of artificial intelligence.

IEEE International Electron Devices Meeting Announces Program Highlights for 2022

The 68th annual IEEE International Electron Devices Meeting, the world’s leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.

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