Optimized 3nm process achieves 45% reduced power usage, 23% improved performance, and 16% smaller surface area compared to 5nm process.
Packaging
Breker Verification Systems Joins RISC-V International
Breker Verification Systems, a provider of advanced test content synthesis solutions, including RISC-V Cache Coherency and other SoC integration Verification Intellectual Property (VIP) in the “TrekApps” family, today joined RISC-V International (RVI) as a strategic member.
Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing
This week, at the 2022 IEEE International Interconnect Technology Conference (IITC 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future interconnects using direct metal patterning.
Palomar Technologies places SST 5100 Vacuum Furnace at the EPIC-CENTRE-Torbay to Support Optoelectronics Packaging
Palomar Technologies announced the consignment of an SST 5100 Vacuum Reflow Furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, UK.
LEGO Stacking of 2D Materials Brings Us a Step Closer to Ultracompact Memory and Spintronic Technology
SUTD scientists designed a novel functional 2D hybrid material for ultracompact memory and spintronic device applications.
Weebit Nano Tapes Out ReRAM Demo Chip to SkyWater Foundry
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced it has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module to SkyWater Technology’s foundry.
Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Flex Logix EFLX embedded FPGA brings reconfigurable computing to CEVA-X2 DSP instruction extension to support demanding and changing workloads.
SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
SiFive, Inc., the founder and leader of RISC-V computing, today announced the opening of its new UK Research & Development (R&D) Center headquartered in Cambridge, United Kingdom.
Micron Delivers Industry’s First 176-Layer NAND SATA SSD for Data Centers
Micron Technology, Inc. today announced it is shipping the world’s first 176-layer NAND SATA SSD designed for data center workloads.
ALD/CVD Precursor Markets – Burgeoning Applications
Advanced Logic and Memory Applications require more deposition materials.
