Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).
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Rambus Completes Acquisition of AnalogX
Rambus Inc., a provider of chips and silicon IP making data faster and safer, today announced the completion of the acquisition of AnalogX.
Brooks Instrument Celebrates 75 Years of Innovation in Fluid Measurement and Control
Brooks Instrument is celebrating its 75th year providing high-precision fluid measurement and control instrumentation.
Si2 Annual Technical Forum Focuses on Semiconductor Design in the Cloud
The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. – to 10:00 a.m. Pacific Standard Time.
Infineon and Amber Announce Collaboration
Applications include a broad range of silicon opportunities around Amber’s DC extraction directly from AC Mains and indestructible AC Switching technologies for smart circuit breakers, dimmers and new, unique solutions integrated with Infineon’s suite of technologies.
Worldwide IC Market Forecast to Top $500 Billion in 2021
Industry firing on all cylinders with robust and widespread demand for ICs.
US Lacks Essential Data to Develop and Implement a National Strategy for Advanced Technologies
Years of budget constraints have left federal statistical agencies with insufficient resources to measure key elements of the U.S. economy.
Micron to Sell Lehi, Utah, Fab to Texas Instruments
Micron Technology, Inc. announced today that it has entered into a definitive agreement to sell its Lehi, Utah, fab to Texas Instruments.
SEMICON Taiwan Postponed to December 2021 or January 2022
SEMICON Taiwan has been postponed from September 8-10 to December 2021 or January 2022 in response to a resurgence of COVID-19 cases in Taiwan, SEMI Taiwan announced today.
Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology
This tapeout is the culmination of an extensive collaboration between Synopsys and Samsung Foundry to accelerate the delivery of a highly optimized reference methodology that realizes the maximum power and performance opportunities inherent to the latest 3D transistor architecture.
