Park Systems, the fastest growing manufacturer of Atomic Force Microscopes (AFM) just announced Park FX40, a groundbreaking autonomous atomic force microscope, infused with innovative robotics, intelligent learning features, safety features, software and specialized add-ons.
Packaging
Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets.
A More Robust Memory Device for AI Systems
A research team from Northwestern Engineering and the University of Messina in Italy have developed a new magnetic memory device that could lead to faster, more robust Artificial Intelligence (AI) systems.
New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications
Lattice Semiconductor Corporation today launched the Lattice CertusPro-NX general purpose FPGA family.
Cyient Celebrates First Anniversary of IC Design and Development Center in Duisburg, Germany
AnSem, a Cyient company, announced the first anniversary of the acquisition of an integrated circuit (IC) design center in Duisburg, Germany.
Nordson Electronics Solutions Ships First SELECT Unit from New Global Manufacturing Facility
The relocation expands operations and capabilities for SELECT’s selective soldering systems used in electronics manufacturing.
KLA Launches New Portfolio of Automotive Products to Improve Chip Yield and Reliability
KLA Corporation announced the launch of four new products for automotive chip manufacturing: the 8935 high productivity patterned wafer inspection system, the C205 broadband plasma patterned wafer inspection system, the Surfscan SP A2/A3 unpatterned wafer inspection systems and I-PAT inline defect part average testing screening solution.
Kioxia’s AI Project Wins 2020 Field Innovation Award Silver Prize From Japanese Society for Artificial Intelligence
Kioxia Corporation announced today that it was awarded the 2020 Field Innovation Award Silver Prize by the Japanese Society for Artificial Intelligence (JSAI) for its TEZUKA 2020 project.
Park Systems Appoints Dr. Stefan Kaemmer as President, Park Systems Americas
“Park Systems is experiencing unprecedented expansion, and during the coming years we expect to add significantly to the revenue growth that put us at the One Trillion Mark at Kosdaq in 2021”, comments Dr. Sang-il Park, CEO & Founder of Park Systems.
Microchip Boosts GaN RF Portfolio with Ka-band Monolithic MMIC with High Linearity for SatCom Terminals
The new device, Microchip’s first GaN MMIC, is designed for use in commercial and defense satellite communications, 5G networks and other aerospace and defense systems.
