STMicroelectronics (NYSE: STM) is protecting wireless charging of small devices and mobiles with a convenient solution for authenticating certified Qi chargers.
Packaging
EV Group Launches Step-And-Repeat Mastering Services for Nanoimprint Lithography
EV Group announced that it has established the EVG Step-and-Repeat (S&R) Mastering Shop, a new service offering to help customers accelerate the deployment of nanoimprint lithography (NIL) in high-volume manufacturing.
Paving the Way for Smart Factories
Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.
ROHM Introduces Industry-first AC/DC Converter ICs in a Surface Mount Package with Built-in 1700V SiC MOSFET
ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.
Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.
IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24%
Global IC market expected to exceed $500 billion for the first time.
Alliance Memory Moves Taiwan Office to Larger Facility to Accommodate Global Growth
To help accommodate its rapid global expansion while providing room for future growth, Alliance Memory has moved into a new building in Taiwan with twice the warehouse and office space of the company’s previous local facility.
Imec Reports First Electrical Demonstration of Integrated Forksheet Devices to Extend Nanosheets Beyond 2nm Technology Node
This week, at the 2021 Symposia on VLSI Technology and Circuits (VLSI 2021), imec demonstrates for the first time fully functional integrated forksheet field-effect transistors.
3D Semiconductor Packaging Market Growth Opportunities in the Forthcoming Years with Forecast to 2023
As per the latest report published by Market Research Future (MRFR), the global 3D semiconductor packaging market is likely to reach a valuation of USD 37,472.7 million by the end of 2023, reflecting a healthy growth rate.
Applied Materials Breakthrough in Chip Wiring Enables Logic Scaling to 3nm and Beyond
Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
