This week, at the 2021 Symposia on VLSI Technology and Circuits (VLSI 2021), imec demonstrates for the first time fully functional integrated forksheet field-effect transistors.
Packaging
3D Semiconductor Packaging Market Growth Opportunities in the Forthcoming Years with Forecast to 2023
As per the latest report published by Market Research Future (MRFR), the global 3D semiconductor packaging market is likely to reach a valuation of USD 37,472.7 million by the end of 2023, reflecting a healthy growth rate.
Applied Materials Breakthrough in Chip Wiring Enables Logic Scaling to 3nm and Beyond
Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
NHanced Semiconductors Announces Dedicated High‑Volume Advanced Packaging Facility
NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment.
Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors
Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.
High End FinFet ASIC Market To Approach $20 Billion
The global high end ASIC market will reach nearly $20 billion in five years, driven by high-performance computing applications in data processing and telecommunications, according to James Huang, Vice President, Alchip Technologies.
Gartner Says Global Chip Shortage Expected to Persist Until Second Quarter of 2022
The worldwide semiconductor shortage will persist through 2021, and is expected to recover to normal levels by the second quarter of 2022, according to Gartner, Inc.
sureCore & Intrinsic Announce Collaboration to Bring Novel RRAM Technology to Market
sureCore Limited and Intrinsic Ltd today announced a collaboration agreement to bring high performance embedded RRAM to market.
Cree and Gospower Deliver Silicon Carbide to Server Power Supply Market
Cree, Inc. today announced that Shenzhen Gospower Digital Technology Co., Ltd. will utilize Cree’s Wolfspeed 650V silicon carbide MOSFETs for next generation Common Redundant Power Supply (CRPS) solutions.
SEMI Digital Transformation Conference to Help Microelectronics Industry Seize New Market Opportunities
Business and technology experts will gather July 13-14 at the SEMI Innovation for a Transforming World conference to discuss how digital transformation technologies such as machine learning and artificial intelligence (AI) are reshaping the way microelectronics need to be designed, manufacturing and packaged.
