Packaging

Pfeiffer Vacuum Presents New Turbopumps HiPace 350 and HiPace 450

With the HiPace 350 and 450, Pfeiffer Vacuum presents a turbopump especially dedicated for applications like mass spectrometry, electron-microscopy, metrology tools, particle accelerators and plasma physics. In addition to analytical, vacuum-process and semiconductor technology, their broad range of applications also includes coating, research & development and industrial applications.

SEMICON Japan 2020 Virtual Set to Open with Sustainable Industry Growth, Smart Technology in the Spotlight

SEMICON Japan 2020, the largest and most influential gathering of the electronics manufacturing and design supply chain in Japan, opens Friday as a virtual event with sustainable industry growth and the latest industry trends, developments and innovations in focus.

How the 1985 Downturn Set the Silicon Wafer Industry on a Path to Consolidation That Continues Today

By Craig Addison While 2020 will be remembered as annus horribilis for many, it is set to be a record year for dealmaking in the chip industry.

AGC Develops Glass Package for Edge-emitting Laser Diodes

AGC Inc., a Tokyo-based world-leading manufacturer of glass, chemicals and high-tech materials, has announced the development of a glass package that is ideal for encapsulating edge-emitting laser diode (LD) chips.

Erica Graham an AIM Photonics Journey

AIM Photonics, the Department of Defense (DoD) sponsored Integrated Photonics Manufacturing Institute, heads into its fifth year, with a number of notable accomplishments and technological achievements.

Global Semiconductor Sales Increase 6 Percent Year-to-Year in October; Annual Sales Projected to Increase 5.1 Percent in 2020

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $39.0 billion for the month of October 2020, an increase of 6.0 percent compared to the October 2019 total of $36.8 billion and 3.1 percent more than the September 2020 total of $37.9 billion.

Intel Advances Progress in Integrated Photonics for Data Centers

Today, at Intel Labs Day, Intel highlighted industry-leading technological advances toward the realization of the company’s long-standing vision of integrating photonics with low-cost, high-volume silicon.

Nanomaterials Enable Dual-Mode Heating and Cooling Device

Engineers at Duke University have demonstrated a dual-mode heating and cooling device for building climate control that, if widely deployed in the U.S., could cut HVAC energy use by nearly 20 percent.

MagnaChip Launches New High-Voltage 700V/800V Super Junction MOSFETs

MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX) today announced eight new 700V and 800V series high-voltage Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs), featuring high performance and efficiency and optimized for TV, LED lighting and fast charger applications.

IAR Systems and GigaDevice Extend Partnership With Powerful Arm Solutions

IAR Systems, the future-proof supplier of software tools and services for embedded development, and GigaDevice, an industry-leading semiconductor supplier, announced their powerful solutions for GD32 Arm-based microcontrollers (MCUs).

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