The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today announced two Stanford University professors are the 2021 recipients of SIA-SRC University Research Awards: Dr. Subhasish Mitra, Professor of Electrical Engineering and of Computer Science, and Dr. Boris Murmann, Professor of Electrical Engineering.
Packaging
SkyWater President and CEO, Thomas Sonderman, to Serve as Panelist at Purdue Workshop for Microelectronics and Advanced Packaging Workforce Development
SkyWater Technology (NASDAQ: SKYT) announced that its President and CEO, Thomas Sonderman, is serving as a panelist today at Purdue University’s Microelectronics and Advanced Packaging Workforce Development Workshop in West Lafayette, Indiana.
High Current Rated TOLL MOSFETs from Diodes Incorporated Target EV Applications
Diodes Incorporated has introduced a portfolio of automotive MOSFETs packaged in the space saving, thermally-efficient TOLL package.
Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications
Samsung Electronics today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
After Strong Gains, DRAM Prices Expected To Retreat in 4Q21
DRAM buyers cautious about placing significant orders; opting instead to keep inventory in check.
NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services
NXP Semiconductors today announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs.
TechSearch International’s Analysis Shows Surge in Fan-Out and Embedded Bridge for High Performance Packaging
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight.
Primo1D Raises 15M Euros for Industrial-Scale Deployment
Primo1D today announced a new funding round of 15 million euros from major French capital funds.
aveni, SA Secures Patent For Groundbreaking, One-Step 3D NAND Wet Deposition Process That Replaces ALD And CVD Technologies
aveni SA today announced that it has secured a patent that can extend the industry standard of layers from 100 to 200+ layers on a single wafer for 3D NAND memory devices.
Samsung Develops Industry’s First LPDDR5X DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.
