America won the first cold war by outspending the Soviet Union in nuclear weapons. Many observers believe the US is engaged in a new cold war – with China. If true, it will be fought with technologies like 5G, artificial intelligence and semiconductors – but this time the US is being outspent.
Packaging
Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning for 2µm Chiplet Scaling
Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network.
EV Group Addresses Key Process Gap in Heterogeneous Integration with Collective Die-to-Wafer Hybrid and Fusion Bonding Demonstration
This breakthrough, which was demonstrated at EVG’s Heterogeneous Integration Competence Center, represents an important milestone in accelerating the deployment of heterogeneous integration (HI) in next-generation 2.5D and 3D semiconductor packaging.
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
DIALOG SEMICONDUCTOR and GLOBALFOUNDRIES today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES.
Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
Synopsys, Inc. and Samsung Foundry today announced the release of a validated automotive reference flow to streamline SoC hardware design for in-system test, implementation, verification, timing and physical signoff for ISO 26262 compliance.
Semiconductor Industry Announces Research and Funding Priorities to Sustain U.S. Leadership in Chip Technology
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today released a preview of their upcoming “Decadal Plan for Semiconductors,” a report outlining chip research and funding priorities over the next decade that will help strengthen U.S. semiconductor technology and spur growth in emerging technologies such as artificial intelligence, quantum computing, advanced wireless communications.
ACM Research Highlights Availability of Wafer-Level Packaging Processing Equipment Portfolio for OSAT Customers
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today highlighted the availability of its extended portfolio of wet wafer processing tools designed to meet the advanced technology requirements of outsourced semiconductor assembly and test (OSAT) providers.
Industry’s First Automotive-Compliant 40V Dual MOSFET in 3.3mm x 3.3mm Package Introduced by Diodes Incorporated
Diodes Incorporated today announced the industry’s first automotive-compliant 40V dual MOSFET in a 3.3mm x 3.3mm package.
STMicroelectronics Acquires Power Amplifier and RF Front-End-Module Specialist SOMOS Semiconductor
STMicroelectronics today announced the acquisition and integration of the assets of SOMOS Semiconductor.
Olympus and Hellier NDT Extend Collaboration to Train Future NDT Inspectors
Furthering a partnership that began in 1986, Olympus, a leading manufacturer of nondestructive testing (NDT) solutions, has supplied Hellier’s Houston, Texas location with advanced NDT inspection equipment.
