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Packaging
Navitas Highlights Electrification Opportunities for Next-Gen Semiconductors at Baird Global Industrial Conference
Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits, has announced that it will take part in Baird’s 2021 Global Industrial Conference on November 11th.
Pure Storage Partners with Microsoft Azure to Speed Semiconductor Design
Pure Storage today announced it has partnered with Microsoft Azure to significantly speed next-gen chip design by delivering a data layer that can keep up with massive, concurrent high-performance computing (HPC) workloads running in the cloud.
Amkor Technology Announces Plans to Expand Advanced Packaging Technology Capacity with New Factory in Bac Ninh, Vietnam
Amkor Technology, Inc., a provider of semiconductor packaging and test services, today announced that it plans to build a smart factory in Bac Ninh, Vietnam.
Global Semiconductor Alliance Announces 2021 Award Nominees
The Global Semiconductor Alliance (GSA) announced its 2021 award nominees. The prestigious awards will be presented at GSA’s Virtual Awards Celebration on Thursday, Dec. 9, 2021.
French Semiconductor Ecosystem: Design House IC’Alps Raises €4.2 Million To Sustain Business Growth For Custom Chip Design
Acting on General Shareholders Meeting, semiconductor company IC’Alps announced today it has raised €4.2 Million from French industrial group DOLIAM.
Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports
Worldwide silicon wafer shipments increased 3.3% to 3,649 million square inches in the third quarter of 2021 compared to the previous quarter, a new industry record, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Semtech’s LoRa Devices and the LoRaWAN Standard Boost Urban Forest Management
Semtech Corporation announced that ICT International, an Internet of Things (IoT) solution provider for environmental applications, is leveraging Semtech’s LoRa devices and the LoRaWAN standard to improve urban forest management and carbon accounting.
POET Technologies Collaborates with a Leading Global Supplier of Lasers for POET’s Optical Interposer Platform
POET Technologies Inc. today reported that it has agreed on the first phase of a supply agreement with a global supplier of lasers and other components used in high-speed optical networking equipment.
Aehr Receives $7.6 Million Order for WaferPak Full Wafer Contactors
Aehr Test Systems today announced it has received a $7.6 million order from its lead silicon carbide test and burn-in customer for WaferPak full wafer Contactors to meet their increased production capacity needs.