Packaging

Gel-Pak Wins East Bay Innovation Award for LCS2 Semiconductor Shipping Protection Technology

Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, was honored earlier this month with an East Bay Innovation Award for its new Lid/Clip Super System LCS2TM.

Micron’s New Crucial DDR5 Memory Delivers Blazing Speeds and Massive Bandwidth to Consumers for Next-Gen Desktop PCs

Micron Technology, Inc. today announced the immediate availability of Micron Crucial DDR5 desktop PC memory products that deliver up to 50% faster data transfer speeds over previous-generation DDR4 memory, providing mainstream PC users with enthusiast-level performance.

Maximizing Protection of Flip Chip Interconnects

NCP and NCF property and process optimization deliver high-reliability results.

Supplyframe CIQ Suggests Chip Supply Stabilization Will Not Begin Until 1H 2023

The number of commodity dimensions with red status grew again as the industry entered the fourth quarter of 2021, according to the latest Supplyframe Commodity IQ.

ETEL’s New ST Stroke Actuators Offer Higher Performance in Back-end Semiconductor Manufacturing

ETEL introduced two new short stroke actuators specifically for use as a unique solution for “Test and Scan” turret handlers in semiconductor manufacturing.

Brooks Instrument to Showcase New Pressure-Based Mass Flow Controller at SEMICON EUROPA 2021

Brooks Instrument will feature its new GP200 Series pressure-based mass flow controller (P-MFC) at SEMICON Europa, November 16-19, in Munich, Germany.

Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications

Cadence Design Systems, Inc. today announced that its digital and custom/analog flows have achieved certification for TSMC’s N3 and N4 process technologies in support of the latest Design Rule Manual (DRM).

New ISO 26262 Functional Safety Packages Simplify Design of ASIL B and ASIL C Safety Applications

Microchip Technology Inc. is offering newly certified functional safety packages to enable engineers to develop their products as per the ISO 26262 functional safety standard.

Mobix Labs Opens Design Center in Australia

 Mobix Labs In., today announced it has opened a new design center in Sydney, Australia, with the hiring of a veteran team of engineers who have strong track records in the successful development and layout of radio frequency integrated circuits (RFICs).

Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process

Omni Design Technologies, a provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced the availability of silicon-validated 12-bit 6 Gsps analog-to-digital (ADC) and 12-bit 7 Gsps digital-to-analog (DAC) converters on TSMC’s 16nm process.

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