Packaging

Renesas Introduces 32-bit RX MCU with High-Speed, High-Precision Analog Front End for High-End Industrial Sensor Systems

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its 32-bit microcontroller (MCU) offering with a new RX device for high-end industrial sensor systems.

Weebit Nano Receives Wafers Manufactured in GlobalFoundries’ 22FDX Process

Initial testing has begun on 22nm FD-SOI wafers with embedded Weebit ReRAM.

CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program

Today, the Biden-Harris Administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors.

Professors from Purdue University and the University of Virginia to be Honored for Excellence in Semiconductor Research

The Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) today announced the recipients of the 2023 University Research Awards.

Silicon Labs Expands MCU Platform with New 8-bit MCU family

Silicon Labs today announced the expansion of their microcontroller unit (MCU) development platform with a new family of 8-bit MCUs optimized for price and performance.

Akoustis Awarded Phase 2 For DARPA COFFEE Program

Akoustis Technologies, Inc. was awarded a new multi-year, multi-million dollar contract for Phase 2 of the DARPA COmpact Front-end Filters at the ElEment-level (COFFEE) program.

GlobalFoundries Announces New Multi-Million Dollar Student Loan Repayment Program to Strengthen Semiconductor Workforce

Program designed to build a critical talent pipeline by easing the burden of education debt for U.S. employees.

Growing Supply Chain Risks for Germanium and Gallium

How can the US stabilize Ge/Ga supply to support high semiconductor demand?

Particle Measuring Systems Receives Silver EcoVadis Medal for Progress on Sustainability

Particle Measuring Systems (PMS), a developer of contamination monitoring solutions, announced that it has been awarded a Silver EcoVadis Medal for its progress toward sustainability.

New Semicon Adhesive Propels Autonomous Driving Forward

DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors.

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