The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
Packaging
Applied Materials Announces a Strategic Investment in BE Semiconductor Industries
Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging.
Infineon Launches World’s First Industrial GaN Transistor Product Family with Integrated Schottky Diode
Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky diode for industrial use.
Canatu Signs Joint Development Agreement with DENSO to Improve Carbon Nanotube Performance
Canatu Plc has signed a one-year joint development agreement with DENSO Corporation, a supplier of automotive technology and components, to improve the performance of Canatu carbon nanotubes.
Qolab Spearheads Hardware Development for DARPA’s Quantum Benchmarking Initiative
Qolab is spearheading the hardware development of the consortium, focusing on designing and fabrication of the quantum processors.
SEMI Silicon Photonics Industry Alliance Launches Three Special Interest Groups to Lay Out a Technology Roadmap
The SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar today, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization.
FormFactor Introduces the EVOLVITY 300 Probe System
Company expands the 300mm product line with new semi-automated system.
Nexperia Introduces New High Speed Optimized Flip-Chip Package Technology
New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry’s first side-wettable flank versions.
SEALSQ Appoints COO to Spearhead Its North American Operations
SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, announced today the appointment of Loïc Hamon as its Chief Operating Officer (COO), as part of the Company’s strategic expansion in the North American market, effective immediately.
Inaugural SEMIEXPO Heartland Event Underscores Midwestern U.S. as a Global Hub for Smart Manufacturing and Smart Mobility
The inaugural SEMIEXPO Heartland event welcomed leaders in smart mobility and smart manufacturing to the Indiana Convention Center to explore opportunities for collaboration across both disciplines.
