Veeco Instruments Inc. today announced its received over $35 million of orders for its AP300 Lithography systems in recent quarters from a wide-range of IDM and OSAT customers.
Packaging
CHIPS Act and R&D – Who Will Pay for Leading Edge?
An increased investment in R&D is required, as well as a strategic rethinking of how existing manufacturing infrastructure can be modernized to meet future demands.
Dry Claw Vacuum Pumps from Atlas Copco Boast Long Operating Time
Clean technologies are of particular importance in vacuum technology – because they are economically advantageous and environmentally friendly. With this in mind, Atlas Copco has developed the DZS 600 VSD+ and DZS 1200 VSD+.
Expanding Access to Advanced Chip Design Capabilities: Launch of the EU Chips Design Platform
A consortium of 12 European partners has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
The Outlook For The Precursor Market Remains Strong
Key growth areas include high-k metal and dielectric precursors for emerging transistor architectures and advanced packaging.
Alpha and Omega Semiconductor Enables 48V Hot Swap in AI Servers with New High SOA MOSFET
Alpha and Omega Semiconductor Limited today announced its AOTL66935 utilizes AOS’ 100V AlphaSGT proprietary MOSFET technology.
Promex Industries Expands Capabilities, Installing Laser Depaneling and Advanced SPI Systems on Manufacturing Line
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced it has expanded its manufacturing line, adding two advanced systems designed to support the industry’s most demanding microelectronics applications.
NoMIS Power Unveils Major Advancement in Next-Gen SiC Planar MOSFETs
NoMIS Power has announced a key advancement in its next-generation 1.2 kV planar SiC MOSFET platform, achieving substantial reductions in on-resistance by optimizing device design and process steps — making it easier than ever to drop SiC into legacy systems or push the boundaries of new power converter designs.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
