New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes.
Packaging
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix Platform
Ansys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.
SEALSQ and IC’ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
SEALSQ Corp. today announces a strategic collaboration with IC’ALPS, a ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels.
Automotive Electrification Movement
Whether designing for passenger or commercial vehicles, engineers today must consider numerous complex, power-hungry systems and features that not only meet consumer and commercial demand but are also highly efficient, durable and safe.
Pragmatic Semiconductor Set to Revolutionize NFC Connectivity with Sustainable Flexible Chips
Pragmatic Semiconductor Ltd. today announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
Toray Engineering Co., Ltd. has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging.
The Shape of Tomorrow’s Semiconductor Technology
The theme of the 70th annual IEEE IEDM was “Shaping Tomorrow’s Semiconductor Technology.” Read about the latest advances in logic, memory, high frequency and power devices, and more.
Kulicke & Soffa Introduces Asterion-PW for Power Semiconductor Applications
Kulicke and Soffa Industries, Inc. announced the launch of Asterion-PW, extending its leadership in power device applications with a fast and precise ultrasonic pin welding solution.
Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
Silvaco Group, Inc. today announced that Faraday Technology Corporation has selected Silvaco’s FlexCAN IP to establish a robust networking backbone for its latest automotive ASIC design.
Veijo Kontas Joins proteanTecs Advisory Board
A veteran of the semiconductor and wireless industries, Kontas brings decades of expertise in SoC development to support proteanTecs’ strategic growth in telecommunications.
