The Global Lidar Market is projected to grow at a CAGR of 8.01% from 2024 to 2031, according to a new report published by Verified Market Research.
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Wolfspeed Tops Out World’s Largest, Most Advanced Silicon Carbide Facility
Wolfspeed held a ceremony to celebrate the topping out of construction at the $5 billion John Palmour Manufacturing Center for Silicon Carbide.
NY CREATES’ Albany NanoTech Complex Receives Recertification from TÜV SÜD AMERICA INC.
This recertification provides assurance that NY CREATES’ quality management system consistently provides products and services which meet the stringent requirements of the internationally recognized ISO 9001 standard.
Sivers Semiconductors Extends Partnership with Strategic Lead SATCOM Customer
Sivers Semiconductors AB, a supplier of integrated chips and modules for the most advanced communications and sensor solutions, today announced that its subsidiary Sivers Wireless has signed a third product development agreement with its lead European Satellite Company.
Efinix Rolls Out Line of FPGAs
Efinix today announced a line of FPGA solutions designed specifically for the automotive industry to drive forward the long-term design and development of the rapidly growing numbers of electronic applications in-and-outside vehicles.
Trane/Mitsubishi SMART MULTI Line Expands with Three-Phase System Ideal for Light Commercial Applications
Trane – by Trane Technologies has introduced new innovations to provide outdoor heat pump technology to multi-zoned buildings, optimize indoor environments, and empower customers to start their transition to next-generation refrigerants.
New Structure Transistors for Advanced Technology Node CMOS ICs
In a paper published in National Science Review, a Chinese team of scientists from Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) reviewed structural innovations in Si-based transistors from planar transistors and fin field-effect transistor (FinFET) to latest gate-all-around FET (GAAFET), and even cutting-edge vertical transistor stacking, e.g. in complementary FETs (CFETs), 3D stack (3DS)-FETs and vertical-channel transistors.
SEMI: 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027 after topping US$100 billion for the first time by 2025.
Synopsys Announces Acquisition of Intrinsic ID
Synopsys, Inc. today announced that it has completed the acquisition of Intrinsic ID.
Three Strong Brands Form the Global Busch Group
Busch Vacuum Solutions, Pfeiffer Vacuum and centrotherm clean solutions have become one under the new Busch Group.
