SEMI reaches milestone with publication of energetic materials safety guideline.
Semiconductors
Standards Industry Leaders Honored at SEMICON West 2019
SEMI yesterday honored five industry leaders at SEMICON West 2019 for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards 1000th Standard Celebration.
CEA-Leti and UnitySC Announce Further Collaboration
Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced a four-year extension of their collaboration to further advance metrology-inspection capabilities per tool, while reducing the tools’ footprint and cost of ownership.
How “Guardbanding” of Inline Wafer Defects Can Improve Chip Reliability Insurance
The semiconductor industry has long used a process known as digital guardbanding to ink-off suspect die.
Maximizing EUVL System Availability
The innovative process of extreme ultraviolet lithography, known in its short form as EUVL or EUV, is the next generation lithography technology that leading semiconductor chip-makers plan to use in the manufacturing of the most advanced semiconductor components.
2019 Rare Earths Rarely So Strategic
Global supply-chains are being disrupted by the U.S./China trade wars, driving increased awareness of the strategic importance of rare-earth elements (REE).
X-rays Reveal Monolayer Phase in Organic Semiconductor
A team of researchers from Russia, Germany, and France featuring materials scientists from the Moscow Institute of Physics and Technology has investigated how the electrical properties of dihexyl-quarterthiophene thin films depend on their structure.
KLA Announces New Defect Inspection and Review Portfolio
On Tuesday, KLA Corp. announced the 392x and 295x optical defect inspection systems and the eDR7380TM e-beam defect review system.
CEO Panel Tackles the Future of Moore’s Law Question
On Tuesday morning, Applied Materials hosted a CEO panel discussion with Aart de Geus, PhD, Chairman and co-Chief Executive Officer, Synopsys; Victor Peng, President and CEO, Xilinx; Lisa Su, PhD, President and CEO, AMD; Sanjay Mehrotra, President and CEO, Micron; and Gary Dickerson, President and CEO, Applied Materials. John Markoff, author and former technology writer with The New York Times acted as moderator.
SEMI Announces Election and Re-Election of Board Members
SEMI today announced at SEMICON West 2019 the election of Kazuo Ushida, Chairman of the Board, Representative Director, Nikon Corporation, as a new member of the SEMI International Board.
