According to the report published by Allied Market Research, the global embedded die packaging technology market generated $63.93 million in 2020, and is estimated to generate $311.41 million by 2030, witnessing a CAGR of 18.2% from 2021 to 2030. The report offers a detailed analysis of changing market trends, value chain, top segments, key investment pockets, regional scenarios, and competitive landscape.
Increase in requirement for miniaturization of electronic circuits in microelectronic devices drives the growth of the global embedded die packaging technology market. However, high initial costs of embedded die packaging hamper the market growth. On the other hand, increase in adoption of smartphones and smart wearables creates new opportunities in the coming years.
- The global economy was disturbed by the unprecedented situation of the pandemic, and the embedded die packaging technology market had affected negatively, especially in the early stages.
- The production facilities have slowed as a result of the Covid-19 epidemic, which in turn improved the demand for electronics and semiconductor products in these industries. Its major implications include a significant manufacturing halt in Europe and a stoppage in Chinese materials exports, both of which hamper the expansion of the embedded die packaging technology market.
The report offers detailed segmentation of the global embedded die packaging technology market based on platform, industry vertical, and region.
Based on platform, the embedded die in IC package substratesegment held the highest market share in 2020, accounting for nearly half of the total share, and is projected to maintain its leadership status during the forecast period. However, the embedded die in flexible boardsegment is estimated to grow at the fastest CAGR of 20.4% from 2021 to 2030.