Flagello to receive Zernike Award at SPIE Advanced Lithography

Donis Flagello, president, CEO, and COO of Nikon Research Corporation of America (NRCA), will be presented with the 2017 Frits Zernike Award for Microlithography on Monday 27 February during SPIE Advanced Lithography in San Jose, California. The award, presented annually…

Photoelectric measure of atomically thin stacks

A team led by researchers at the University of Warwick have discovered a breakthrough in how to measure the electronic structures of stacked 2D semiconductors using the photoelectric (PE) effect. Materials scientists around the world have been investigating various heterostructures…

CSP Market Forecast – Strong

Chip-Scale Packages (CSP) continue to be in strong demand for IC needing the smallest form-factors for applications including automotive, industrial applications to mobile phones and wearable electronics, according to leading market research firm TechSearch International. TechSearch’s latest CSP market forecast…

Dan Rose departs material realm

With sadness I post that Daniel J. Rose, Ph.D.—founder of Rose Associates—passed away on September 20, 2016, due to complications of Alzheimer’s disease. Dan Rose received a Ph.D. in materials engineering from the University of British Columbia, and subsequently spent…

ASM’s Haukka ALD Award

Dr. Suvi Haukka, executive scientist at ASM International, located in Finland, was awarded the ALD Innovation prize at the ALD 2016 Ireland conference (Figure), as chosen by the conference chairs. Haukka has had a lifetime career in Atomic Layer Deposition…

The Last Technology Roadmap

After many delays, the last ever International Technology Roadmap for Semiconductors (ITRS) has been published. Now that there are just a few companies remaining in the world developing new fab technologies in each of the CMOS logic and memory spaces,…

Broadening Scope of SEMICON

Once upon a time, SEMICONs were essentially just for semiconductor manufacturing business and technology, and predominantly CMOS ICs. Back when we followed public roadmaps for technology to maintain the cadence of new manufacturing nodes in support of Moore’s Law, it…

Trefonas Earns 2016 Perkin Medal

The Society of Chemical Industry (SCI), America Group, announced on May 5, 2016 that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at Dow Chemical Co (NYSE:DOW), has won the 2016 SCI Perkin Medal. This honor recognizes Trefonas’ contributions in…

RFID Playing Cards “Best Product” at Printed Electronics Europe

Cartamundi, imec and Holst Centre (set up by imec and TNO) recently won the Best Product Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi’s playing cards. In each card, the RFID chip has a…

Omhi kept us Ultra-Clean

Sadly, I just recently learned from the UCPSS 2016 website that Ohmi-sensei—Professor Doctor Tadahiro Ohmi—passed away in Sendai on 21 February 2016. As the guru of ultra-clean technology, he established the global Ultra Clean Society in 1988, founded the International…

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