New cleanroom equipment creates ideal space for students to learn advanced packaging processes.
Editor’s Picks
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
UT, ACC, Texas Institute for Electronics to Launch Semiconductor Training Center
A new partnership among The University of Texas at Austin, Austin Community College District and Texas Institute for Electronics (TIE) will make Central Texas a premier hub for comprehensive workforce development that will fuel the needs of America’s semiconductor industry.
New Omdia Research Reveals 2023 Semiconductor Market Revenue Down 9% from 2022
Omdia’s latest Competitive Landscape Tool report reveals a downturn in the semiconductor industry, with revenue down 9% from $597.7 billion in 2022 to $544.8 billion in 2023.
Research Team Achieves First-Reported, Complete Vascularization of Organoids on Microfluidic Chip
CEA-Irig, CEA-Leti and fellow European and Canadian institutes and researchers have demonstrated the complete vascularization of organoids on a microfluidic chip at speeds and flow rates similar to blood’s, improving functional maturation and enabling their long-term survival.
SEMI: 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027 after topping US$100 billion for the first time by 2025.
University of Texas To Offer Semiconductor Master’s Program Starting Fall 2025
A new master’s degree program at The University of Texas at Austin will help fill the demand for semiconductor scientists and engineers and give students a chance to lead the next wave of innovation in the booming semiconductor industry.
STMicroelectronics Breaks the 20nm Barrier for Cost-Competitive Next-Gen Microcontrollers
STMicroelectronics announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices.
Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging
Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
