Editor’s Picks

New Insight into Two Widely Accepted Forms of Deep Learning

Experts at BrainChip offered new insights and considerations for the use of transfer learning and incremental learning in edge AI/IoT environments.

Singapore’s Five Research Pillars Outlined at SEMICON Southeast Asia

At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.

Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem

Intel Foundry Services will lead the first phase of the U.S. Department of Defense’s RAMP-C program to establish a domestic commercial foundry infrastructure.

IBM Unveils On-Chip Accelerated Artificial Intelligence Processor

At the annual Hot Chips conference, IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time.

NVIDIA Founder and CEO Jensen Huang to Receive Semiconductor Industry’s Top Honor

The Semiconductor Industry Association (SIA) today announced Jensen Huang, founder and CEO of NVIDIA and a trailblazer in building accelerated computing platforms, is the 2021 recipient of the industry’s highest honor, the Robert N. Noyce Award.

Automotive MCU Sales to Surge 23% in 2021 Despite Shortages

32-bit designs are expected to generate almost 77% of automotive microcontroller revenues this year, followed by 18% from 16-bit and 6% from 8-bit, says Mid-Year Update report.

WF6 and NF3 Demand Expected To Outstrip Supply By 2025 Driven By 3D NAND Memory Evolution

2021 recovery for specialty gases stronger than first anticipated.

Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1

Sales in June were 2.1% more than the May 2021 total of $43.6 billion.

Robust Growth Rates Expected For Nearly All IC Products in 2021

Special Purpose Logic, DRAM, Cellphone MPUs, and Display Drivers forecast to lead industry-wide upturn as demand extends into the second half of the year.

Intel Accelerates Process and Packaging Innovations

Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.

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