Littelfuse, Inc. announced today the appointment of Dr. Greg Henderson to the company’s board of directors, effective May 15, 2023.
Packaging
Advanced Semiconductor Packaging Technologies: The Development Trend and the Growth Drivers, IDTechEx Reports
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore’s law and rising costs of monolithic Si IC development and manufacturing.
Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0
Samsung Electronics Co. Ltd. today announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.
Entegris Opens Manufacturing Facility in Kaohsiung, Taiwan
The 54,000-square-meter facility will be Entegris’ largest manufacturing facility producing solutions critical to chipmakers.
IMAPS & IPC to Host On-Shoring Workshop July 10-12, 2023 in Washington, DC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, in Washington, DC.
Silicon Catalyst Announces “Silicon Startups Contest” in Partnership with Arm
Worldwide call for applicants to qualify and win significant commercial and technical support from Arm.
Fujifilm to Acquire Semiconductor High Purity Process Chemicals Business from Entegris for $700 Million
FUJIFILM Corporation today announced that the company has entered into a definitive agreement to acquire the semiconductor high purity process chemicals (HPPC) business, CMC Materials KMG Corporation (KMG), from the US-based Entegris, Inc. for $700 million.
Save the Date: Gordon Moore Tribute, June 1
An event to commemorate the life, work and legacy of Intel’s co-founder is planned for June 1.
GlobalFoundries Announces Chief Financial Officer Transition and Names New Chief Business Officer
GlobalFoundries today announced the appointment of two new senior executives to its leadership team.
Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
Mitsubishi Electric Corporation announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module.
