The University of St. Gallen in Switzerland recognizes SUSS MicroOptics with the “Swiss Manufacturing Award” for its outstanding contribution to Switzerland’s manufacturing ecosystem.
Packaging
Alpha and Omega Semiconductor Introduces Latest 80V Power MOSFET With Shield Gate Technology
The new 80V Power MOSFET technology has lower switching losses in hard switching, topologies and have less voltage overshoot than the previous generation.
Acorn and UCLouvain Professor Collaborate on Groundbreaking Silicon-on-Insulator Research Project
Acorn Technologies today announced a research collaboration with Jean-Pierre Raskin, PhD, a full professor at the Université catholique de Louvain (UCLouvain), Belgium’s largest French-speaking university.
ERS Now Offers its Technology for Fan-out Debonding and Warpage Adjustment in a Fully-Automatic Machine for Panels up to 650 x 650 mm
ERS electronic, a developer of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging
YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology
YES (Yield Engineering Systems, Inc.), a manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels.
Fraunhofer ENAS Successfully Manufactures Ultra-Thin and Highly Flexible Parylene-Based Printed Circuit Boards with Several Metallization Layers
Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.
Partnership Between SUSS MicroTec and SET to Develop a Combined Equipment Solution for 3D Chip Integration
SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.
Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs.
SEMICON Europa 2021 Opens Tomorrow with Executive Forum, Smart Technologies and Digital Transformation in Spotlight
SEMICON Europa 2021, Europe’s premier gathering of the entire electronics design and manufacturing supply chain, opens tomorrow for the latest insights from visionaries and industry leaders on smart technologies, digital transformation, and how the microelectronics industry can enable a secure and sustainable digital future.
Classiq to Collaborate with The Fraunhofer Institute
Classiq, which provides a breakthrough Quantum Algorithm Design platform, announced today that it is collaborating with the Fraunhofer Institute, an applied research organization in Europe, as well as other major academic centers, on the development of software for industrial use of quantum computers.
