Packaging

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins

The Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.

JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency

JEDEC Solid State Technology Association today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard.

FormFactor Receives SK hynix Best Partner Award

FormFactor, Inc., a supplier of electrical test and measurement solutions for the semiconductor industry, announced today that it has been recognized as an outstanding partner by SK hynix, a global leader in DRAM and Flash memory manufacturing.

TechSearch International Analyzes Hybrid Bonding Developments and Panel Market Growth

In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.

Pivotal Systems Opens New Manufacturing Facility in Malaysia to Meet Growing Demand for Gas Flow Solutions

Pivotal Systems Corporation has officially announced the opening of a new high volume manufacturing facility in Malaysia.

Lightmatter and ASE Partner to Bring 3D Photonics to Market

Lightmatter today announced a strategic collaboration with Advanced Semiconductor Engineering, Inc., the world’s largest semiconductor packaging and testing services provider.

Professors from Georgia Tech and University of Michigan To Be Honored for Excellence in Semiconductor Research

The Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) today announced the recipients of the 2024 University Research Awards.

Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package

Lightmatter today announced a strategic partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform.

RED Semiconductor Chosen for Silicon Catalyst Semiconductor Incubator

RED Semiconductor, a UK based startup innovating processors for AI and cryptography at the edge, has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator program.

Pivotal Systems Accelerates Global Expansion with New Manufacturing Facilities in South Korea

Pivotal Systems Corporation, a provider of advanced gas flow control solutions across semiconductor and high-tech industries, announced the opening of its first manufacturing facility in South Korea.

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