Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications.
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NY CREATES and Raytheon Unveil Collaborative Semiconductor Workforce Training Initiative
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), in collaboration with Raytheon, an RTX business, announced the deployment of the NY CREATES/Raytheon Workforce Training Program.
Biden-Harris Administration Announces CHIPS Act Funds for Absolics for Development of Glass Substrate Technology
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership.
SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs
RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.
The Dominican Republic and Purdue University Sign MOU to Drive Semiconductor Growth
The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country’s semiconductor industry and national development.
NHanced Semiconductors Launches New Website
Redesigned website showcases the company’s innovative Foundry 2.0 manufacturing model, with intuitive navigation and more news and blog options.
Alpha and Omega Semiconductor Introduces Half-Bridge MOSFET for DC-DC Applications
By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET provides a leading solution for space-constrained DC-DC Buck applications.
Lattice Introduces Advanced 3D Sensor Fusion Reference Design for Autonomous Applications
Lattice Semiconductor, the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development.
Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption
Andes Technology and Arteris partnership aims to support the growing adoption of RISC-V SoCs by mutual customers.
Wise-integration & Leadtrend Technology Introduce GaN System-in-Package
Wise-integration and Leadtrend Technology Corporation, a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications.
