SEMI Europe today announced recipients of the SEMI European Award and Special Service Award for 2023 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2024).
Packaging
Nordson to Demonstrate Plasma Treatment, Fluid Dispensing Systems at SEMICON China 2024
Nordson Electronics Solutions will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645.
DuPont Renews Collaboration with Silicon Catalyst
Silicon Catalyst, the world’s only incubator focused exclusively on accelerating semiconductor solutions, announced today that DuPont has renewed its engagement as a Strategic Ecosystem Partner.
Heraeus Printed Electronics and SUSS MicroTec Announce Joint Development
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.
SEMI ISS Europe 2024 Opens Tomorrow
Registration is open for the March 6-8 executive conference.
SEALSQ to Establish an OSAT Center in Saudi Arabia
SEALSQ Corp. today announced a significant initiative to establish an Open Semiconductors Assembly and Test (OSAT) Center in Saudi Arabia.
CG Power and Industrial Solutions Limited, Renesas, and Stars Microelectronics, to Jointly Build OSAT Facility in India
The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.
Pfeiffer Vacuum Introduces New HiCube Neo Turbo Pumping Station
With pumping speeds ranging from 80 to 800 l/s, the HiCube Neo vacuum pumping station is ideal for demanding high vacuum and ultra-high vacuum applications.
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies
IPC, the global association for electronics manufacturing, praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging
Today, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.
