Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, today announced financing of €15 million.
Packaging
Silicon Wafers Market – Growth on the Horizon 2024-2028
Wafer shipments expected to pick up in late 2024.
Ancora’s Double Side Cooling GaN-FET Demonstrates Superior Robustness and Long Term Reliability
Ancora Semiconductor Inc. has recently passed a series of rigorous DMTBF (Demonstrated Mean Time Between Failures) tests for its double-sided cooling GaN (Gallium Nitride) field-effect transistor.
Samsung and Nova Publish Joint Research at SPIE Advanced Lithography Conference
The papers will be presented at the SPIE by Nova and Samsung, at the Metrology, Inspection and Process Control conference.
Vishay Intertechnology Appoints David McConnell Chief Financial Officer
Vishay Intertechnology, Inc. today announced that its Board of Directors has appointed David McConnell, Senior Vice President -Corporate Treasurer and Risk Management, to the role of Executive Vice President – Chief Financial Officer, replacing Lori Lipcaman who is resigning from that position.
Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award
Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
Samsung Develops Industry-First 36GB HBM3E 12H DRAM
Samsung Electronics Co., Ltd. today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.
IDTechEx Discusses Advancing Integration in Antenna Packaging Technologies for 5G and 6G
Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.
Micron Collaborates with Samsung on Galaxy S24 Series to Unlock the Era of Mobile AI Experiences
Samsung’s flagship Galaxy S24 Ultra, S24+ and S24 incorporate Micron’s high-performance, power-efficient LPDDR5X and UFS 4.0.
Scintil Achieves Integration of III-V DFB Lasers and Amplifiers with Standard Silicon Photonics Technology in Production at Tower Semiconductor
This significant milestone is pivotal in reinforcing Scintil’s supply chain and meeting growing demand for high-performance communication solutions in data centers, artificial intelligence (AI) and 5G networks.
