The semiconductor industry’s collaborative success is one of the most inspiring stories of the past decades. It followed a compelling script of chip scaling for persistent improvements in terms of power, performance, area, and cost. The innovations it enabled have transformed every aspect of our lives.

That story is nowhere near its end.

Tackling system scaling challenges on the fronts of power, heat, memory, and compute requires combined technology, system and circuit research. Continued transistor scaling will go hand in hand with approaches such as advanced optical and electrical interconnects. New compute solutions for AI are pushing the boundaries of what is possible, enabling more efficient and powerful AI applications. Catalyzed by initiatives such as the worldwide Chips Acts, these core innovations will move to the market much quicker than before – powering AI-enabled applications in domains such as automotive, health, consumer products, and many more.

Imec Technology Forum World will put you in a front-row seat to catch up on this next act of digital transformation.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.